UK chipmaker EnSilica has forged a strategic partnership with Taiwan’s leading semiconductor company, TSMC.
- The partnership is aimed at accelerating innovation in chip technology through the Open Innovation Platform.
- EnSilica’s expertise will be combined with TSMC’s advanced process technologies to enhance system-on-chips.
- The collaboration is set to boost EnSilica’s product offerings in AI and mobile applications.
- TSMC reaffirms its commitment to empowering partners to achieve quick market entry.
UK chipmaker EnSilica proudly announces its strategic partnership with Taiwan’s largest semiconductor firm, TSMC. This collaboration is a significant milestone in EnSilica’s efforts to enhance its technological offerings and drive innovation in the semiconductor industry. The partnership sees EnSilica joining the TSMC Open Innovation Platform’s Design Center Alliance, which is designed to minimise design barriers and improve the chances of first-time silicon success. This platform plays a critical role in enhancing the performance and power efficiency of next-generation AI and mobile application chips.
EnSilica, renowned for its application-specific integrated circuits (ASICs), aims to leverage this partnership to enable the next-generation development of system-on-chips. These chips range from mixed-signal devices tailored for industrial and automotive purposes to communication and edge AI chips. EnSilica’s involvement with TSMC’s advanced technologies ensures the delivery of superior solutions to their mutual clientele.
CEO Ian Lankshear of EnSilica expressed that joining the TSMC DCA programme is a considerable achievement for the company. ‘Our profound expertise in mixed signal and RF design, coupled with TSMC’s cutting-edge technology, positions us to deliver unparalleled solutions to our mutual customers.’
Dan Kochpatcharin, head of Ecosystem and Alliance Management Division at TSMC, highlights the importance of this collaboration, stating, ‘TSMC is committed to collaborating with our OIP ecosystem partners, including EnSilica, to empower customers in achieving their design goals and quickly bringing their innovation to market.’
The partnership also marks another milestone in EnSilica’s trajectory of growth, following the award of a new ASIC design and supply contract by Siemens AG. In addition, EnSilica has successfully shipped five million ASICs for a carmaker’s chassis control units, showcasing its remarkable capabilities.
Financially, EnSilica posted half-year revenues of £9.6m, reflecting an 11.5% increase over the previous year, despite a slight widening of pre-tax losses to £309k. Their stocks have remained stable as of the latest trading session in London, although there has been a notable appreciation of one-third since the year’s inception.
The partnership between EnSilica and TSMC signifies a robust alliance set to drive significant advancements in semiconductor technology.
